NUF2441FC

www.DataSheet4U.com NUF2441FC Integrated Passive Filter with ESD Protection This device is designed for cell phone applications requiring Headset and Speaker Phone, EMI Filtering and ESD Protection. This device offers an integrated solution in a small package reducing PCB space and cost. Features: http://onsemi.com CIRCUIT DESCRIPTION B2 C1 B1 A1 C1 L C2 L C2 B3 A3 Provides EMI Filtering and ESD Protection Single IC Offers Cost Savings by Replacing 2 Inductors, 4 Capacitors, and 4 TVs Diodes Compliance with IEC61000−4−2, (Level 4) 30 kV (Contact), 30 kV (air) Flip−Chip Package Moisture Sensitivity Level 1 ESD Ratings: Machine Model = C ESD Ratings: Human Body Model = 3B This is a Pb−Free Device* A2 Benefits: Flip−Chip Package Minimizes PCB Space Integrated Circuit Increases System Reliability versus Discrete Component Implementation TVs Devices Provide ESD Protection That is Better than a Discrete Implementation because the Small IC minimizes Parasitic Inductances A1 Flip−Chip CASE 499J 2441 A Y WW È MARKING DIAGRAM 2441AYWW Typical Applications: Cell Phones Communication Circuits MAXIMUM RATINGS (TA = 25°C) Rating ESD Discharge IEC61000−4−2 Contact Discharge Air Discharge Operating Temperature Range Storage Temperature Range Lead Solder Temperature (10 second duration) Symbol Vpp 30 30 TJ Tstg TL −40 to +125 −55 to +150 260 °C °C °C Value Unit kV = Specific Device Code = Assembly Location = Year = Work Week PIN CONFIGURATION A1 B1 A2 B...