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NTMFS5C404NLT

ON Semiconductor

Power MOSFET

NTMFS5C404NLT Power MOSFET 40 V, 0.75 mW, 352 A, Single N−Channel Features • Small Footprint (5x6 mm) for Compact Desig...


ON Semiconductor

NTMFS5C404NLT

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Description
NTMFS5C404NLT Power MOSFET 40 V, 0.75 mW, 352 A, Single N−Channel Features Small Footprint (5x6 mm) for Compact Design Low RDS(on) to Minimize Conduction Losses Low QG and Capacitance to Minimize Driver Losses NTMFS5C404NLTWF − Wettable Flank Option for Enhanced Optical Inspection These Devices are Pb−Free and are RoHS Compliant MAXIMUM RATINGS (TJ = 25°C unless otherwise noted) Parameter Symbol Value Unit Drain−to−Source Voltage Gate−to−Source Voltage Continuous Drain C(Nuortreesnt1R, 3qJ)C Power Dissipation RqJC (Note 1) Steady State TC = 25°C TC = 100°C TC = 25°C TC = 100°C Continuous Drain C(Nuortreesnt1R, 2qJ,A3) Power Dissipation RqJA (Notes 1 & 2) Steady State TA = 25°C TA = 100°C TA = 25°C TA = 100°C Pulsed Drain Current TA = 25°C, tp = 10 ms Operating Junction and Storage Temperature VDSS VGS ID PD ID PD IDM TJ, Tstg 40 ±20 352 249 200 100 49 35 3.9 1.9 900 −55 to + 175 V V A W A W A °C Source Current (Body Diode) IS 191 A Single Pulse Drain−to−Source Avalanche Energy (IL(pk) = 38 A) EAS 907 mJ Lead Temperature for Soldering Purposes (1/8″ from case for 10 s) TL 260 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. THERMAL RESISTANCE MAXIMUM RATINGS Parameter Symbol Value Unit Junction−to−Case − Steady State RqJC 0.75 °C/W Junction−to−Ambient − Steady State (No...




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