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NTF3055L108 Datasheet

Part Number NTF3055L108
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Power MOSFET
Datasheet NTF3055L108 DatasheetNTF3055L108 Datasheet (PDF)

NTF3055L108, NVF3055L108 MOSFET – Power, N-Channel, Logic Level, SOT-223 3.0 A, 60 V Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits. Features • NVF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant Applications • Power Supplies • Converters • Power Motor Controls • Bridg.

  NTF3055L108   NTF3055L108






Power MOSFET

NTF3055L108, NVF3055L108 MOSFET – Power, N-Channel, Logic Level, SOT-223 3.0 A, 60 V Designed for low voltage, high speed switching applications in power supplies, converters and power motor controls and bridge circuits. Features • NVF Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable • These Devices are Pb−Free and are RoHS Compliant Applications • Power Supplies • Converters • Power Motor Controls • Bridge Circuits MAXIMUM RATINGS (TC = 25°C unless otherwise noted) Rating Symbol Value Drain−to−Source Voltage VDSS 60 Drain−to−Gate Voltage (RGS = 1.0 MW) VDGR 60 Gate−to−Source Voltage − Continuous − Non−repetitive (tp ≤ 10 ms) VGS ± 15 ± 20 Drain Current − Continuous @ TA = 25°C (Note 1) − Continuous @ TA = 100°C (Note 2) − Single Pulse (tp ≤ 10 ms) ID 3.0 ID 1.4 IDM 9.0 Total Power Dissipation @ TA = 25°C (Note 1) Total Power Dissipation @ TA = 25°C (Note 2) Derate above 25°C PD 2.1 1.3 0.014 Unit Vdc Vdc Vdc Vpk Adc Apk Watts Watts W/°C Operating and Storage Temperature Range TJ, Tstg − 55 to 175 °C Single Pulse Drain−to−Source Avalanche Energy − Starting TJ = 25°C (VDD = 25 Vdc, VGS = 5.0 Vdc, IL(pk) = 7.0 Apk, L = 3.0 mH, VDS = 60 Vdc) EAS 74 mJ Thermal Resistance −Junction−to−Ambient (Note 1) −Junction−to−Ambient (Note 2) RqJA RqJA °C/W 72.3 114 Maximum Lead Temperature for Soldering Purposes, 1/8″ from case for 10 seconds TL 260 °C Stresses exceeding tho.


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