|
Part Number
|
MXP1126-C |
|
Manufacturer
|
Microsemi |
|
Description
|
Photo Transistor Chip |
|
Published
|
May 9, 2005 |
|
Datasheet
|
 MXP1126-C PDF File
|
Features
•
•
•
•
• Light Activated Photo Transistor Chip Planar NPN Aluminum Wire bondable Backside Metallization - Gold Die Attach methods: Eutectic or Epoxy
Electrical Characteristics @ 25oC
SYMB OL BVCEO BVEBO BVCBO ID hFE
CHARACT ERIST IC Collector-Emi...
Similar Datasheet
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