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MR16R162GAF0

Samsung semiconductor
Part Number MR16R162GAF0
Manufacturer Samsung semiconductor
Description (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die
Published Jan 19, 2006
Datasheet PDF File MR16R162GAF0 PDF File


MR16R162GAF0
MR16R162GAF0


Features
256M x 16/18 -CN9 -CM8 -CK8 ♦ High speed up to 1066 MHz RDRAM storage ♦ 184 edge connector pads with 1mm pad spacing ♦ Module PCB size : 133.35mm x 31.75mm x 1.27mm (5.25” x 1.25” x 0.05”) - 256Mb base RIMM Module ♦ Module PCB size : 133.35mm x 34...




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