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MPXV7002 Datasheet

Part Number MPXV7002
Manufacturers NXP
Logo NXP
Description Integrated Silicon Pressure Sensor
Datasheet MPXV7002 DatasheetMPXV7002 Datasheet (PDF)

MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 5 — 5 May 2021 Product data sheet 1 General description The MPXV7002 series piezoresistive transducers are monolithic silicon pressure sensors. The MPXV7002 is designed for a wide range of applications, particularly applications employing a microcontroller, or microprocessor with analog-to-digital inputs. This transducer combines advanced micromachining techniques, thin-film .

  MPXV7002   MPXV7002






Part Number MPXV7002
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description Integrated Silicon Pressure Sensor
Datasheet MPXV7002 DatasheetMPXV7002 Datasheet (PDF)

Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXV7002 Rev 3, 01/2015 MPXV7002 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPXV7002 series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with A/D inputs. This transducer combines advanced micromachining techniques, t.

  MPXV7002   MPXV7002







Integrated Silicon Pressure Sensor

MPXV7002 Integrated silicon pressure sensor, on-chip signal conditioned, temperature compensated and calibrated Rev. 5 — 5 May 2021 Product data sheet 1 General description The MPXV7002 series piezoresistive transducers are monolithic silicon pressure sensors. The MPXV7002 is designed for a wide range of applications, particularly applications employing a microcontroller, or microprocessor with analog-to-digital inputs. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure. 2 Features and benefits • Ideally suited for microprocessor or microcontroller-based systems • Thermoplastic (PPS) surface mount package • Temperature compensated over +10 °C to +60 °C • Patented silicon shear stress strain gauge • Available in differential and gauge configurations 3 Applications • Hospital beds • HVAC • Respiratory systems • Process control 4 Ordering information Table 1. Ordering information Type number Package Name Description MPXV7002DP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x 7.62 mm body Version SOT1693-1 MPXV7002GC SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 10.67 mm x 10.67 mm x SOT1854-1 12.96 mm body MPXV7002GP SO8 Plastic, small outline package, 8 terminals, 2.54 mm pitch, 12.06 mm x 12.06 mm x SOT1693-3 8.38 mm body NXP Semiconductors MPXV7002 In.


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