MD5811-D256-xxxx

www.datasheet4u.com Mobile DiskOnChip P3 256Mb Flash Disk with M-Systems’ x2 Technology Preliminary Data Sheet, June 2003 Highlights Mobile DiskOnChip™ P3, a member of M-Systems’ DiskOnChip™ family of optimized memory solutions for new-generation mobile handsets, provides high performance and reliability using NAND flash technology. It combines Toshiba’s cutting-edge 0.13 micron NAND flash manufacturing process enhanced for performance and reliability with M-Systems’ x2 technology. Mobile DiskOnChip P3 optimizes real estate and cost structure by incorporating the flash array and an embedded thin controller in a single die. A boot block can be used to boot the OS or initialize the CPU/platform, replacing expensive NOR flash and further reducing memory system costs. Mobile DiskOnChip P3 provides: Flash disk for both code and data storage Low voltage: 1.8V or 3.3 I/O (auto-detect), 3V Core Hardware protection and security-enabling features High capacity: 256Mbit (32MByte) Device cascading option: up to 1Gbit (128MByte) Enhanced Programmable Boot Block enabling eXecute In Place (XIP) functionality using 16-bit interface Small form factors: 48-pin TSOP-I package 85-ball FBGA 7x10x1.2 mm package Enhanced performance with: Multi-plane operation DMA support MultiBurst operation Turbo operation Unrivaled data integrity with a robust Error Detection Code/Error Correction Code (EDC/ECC) Maximized flash endurance with TrueFFS® 6.1 (and higher) flash management software Support for ma...