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MCR89-130D-1.27DSC Datasheet

Part Number MCR89-130D-1.27DSC
Manufacturers Hirose Electric
Logo Hirose Electric
Description Socket for Memory Module Board
Datasheet MCR89-130D-1.27DSC DatasheetMCR89-130D-1.27DSC Datasheet (PDF)

Socket for Memory Module Board MCR89 Series FEM Design Simulation Designed in Miniature 2 Contacts with High Precision Spring sFeatures 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 2. Low Insertion Force This socket prevents mis-inse.

  MCR89-130D-1.27DSC   MCR89-130D-1.27DSC






Part Number MCR89-130D-1.27DSA
Manufacturers Hirose Electric
Logo Hirose Electric
Description Socket for Memory Module Board
Datasheet MCR89-130D-1.27DSC DatasheetMCR89-130D-1.27DSA Datasheet (PDF)

Socket for Memory Module Board MCR89 Series FEM Design Simulation Designed in Miniature 2 Contacts with High Precision Spring sFeatures 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 2. Low Insertion Force This socket prevents mis-inse.

  MCR89-130D-1.27DSC   MCR89-130D-1.27DSC







Socket for Memory Module Board

Socket for Memory Module Board MCR89 Series FEM Design Simulation Designed in Miniature 2 Contacts with High Precision Spring sFeatures 1. High Reliability This socket achieves high reliability in the horizontal contact spring system. 4. Miniature Type and High Density Mounting The low profile with 6.2mm height from the board is suitable for miniaturization of equipment. The 1.27mm pitch between contacts assures mounting with high density. 2. Low Insertion Force This socket prevents mis-insertion force in the preload structure. 5. Wide Effective Mounting Area This socket is capable of widening the effective mounting area on the module printed board, and secures retention function by easy locking. 3. Easy Pattern Design The dip contact through-hole diameter is only Ø0.5, and simplifies the pattern design. 6. Easy Board Mounting The fixing pins are arranged in the same alignment as the contact, so as to easily install the connector in the board. 7. Accessories sProduct Specifications Rating Item 1. Contact Resistance 1000M ohms min. 2. Withstanding voltage No flashover or insulation breakdown. 3. Insulation Resistance 20m ohms max. 4. Vibration No electrical discontinuity of 10 µs or more Current rating: 0.5A Dust covers and jigs to remove the board are available. Operating Temperature Range: -30 to +85ç (Note 1) Storage Temperature Range: -10 to +60ç (Note 2) Storage Temperature Range: 40 to 70% (Note 2) Conditions 500A DC 500V DC / 1 minute 100mA Frequency: 10 to 55.


2005-04-29 : MC44251    MC44250    MST4110C    STR5412    SDA2008    SDA20000    LM121SS1T53    M383L2828ET1    M383L2920BTS-A2    M383L2920BTS-CAA   


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