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MA4BPS301

Part Number	MA4BPS301
Manufacturer	Tyco
Description	PIN Diode Chips with Offset Bond Pads
Published	Apr 27, 2005
Datasheet	MA4BPS301 PDF File

Features

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• Bond Pads Removed From Active Junction Large Bond Pads Support Multiple Bond Wires Rugged Silicon-Glass Construction Silicon Nitride Passivation Polyimide Scratch Protection

Chip Layout

Description
These silicon - glass PIN diode chips ar...

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