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K9F6408Q0C-B Datasheet

Part Number K9F6408Q0C-B
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description 8M x 8 Bit Bit NAND Flash Memory
Datasheet K9F6408Q0C-B DatasheetK9F6408Q0C-B Datasheet (PDF)

K9F6408Q0C K9F6408U0C FLASH MEMORY Document Title 8M x 8 Bit NAND Flash Memory Revision History Revision No. History 0.0 0.1 Initial issue. 1. IOL(R/B) of 1.8V device is changed. -min. Value: 7mA -->3mA -typ. Value: 8mA -->4mA 2. Package part number is modified. K9F6408U0C-Y ---> K9F6408U0C_T 3. AC parameter is changed. tRP(min.) : 30ns --> 25ns 0.2 1. TBGA package is changed. - 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA 2. Part number(TBGA package part number) is changed - K9F6408Q0C-D .

  K9F6408Q0C-B   K9F6408Q0C-B






Part Number K9F6408Q0C-H
Manufacturers Samsung semiconductor
Logo Samsung semiconductor
Description 8M x 8 Bit Bit NAND Flash Memory
Datasheet K9F6408Q0C-B DatasheetK9F6408Q0C-H Datasheet (PDF)

K9F6408Q0C K9F6408U0C FLASH MEMORY Document Title 8M x 8 Bit NAND Flash Memory Revision History Revision No. History 0.0 0.1 Initial issue. 1. IOL(R/B) of 1.8V device is changed. -min. Value: 7mA -->3mA -typ. Value: 8mA -->4mA 2. Package part number is modified. K9F6408U0C-Y ---> K9F6408U0C_T 3. AC parameter is changed. tRP(min.) : 30ns --> 25ns 0.2 1. TBGA package is changed. - 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA 2. Part number(TBGA package part number) is changed - K9F6408Q0C-D .

  K9F6408Q0C-B   K9F6408Q0C-B







8M x 8 Bit Bit NAND Flash Memory

K9F6408Q0C K9F6408U0C FLASH MEMORY Document Title 8M x 8 Bit NAND Flash Memory Revision History Revision No. History 0.0 0.1 Initial issue. 1. IOL(R/B) of 1.8V device is changed. -min. Value: 7mA -->3mA -typ. Value: 8mA -->4mA 2. Package part number is modified. K9F6408U0C-Y ---> K9F6408U0C_T 3. AC parameter is changed. tRP(min.) : 30ns --> 25ns 0.2 1. TBGA package is changed. - 9mmX11mm 63ball TBGA ---> 6mmX8.5mm 48ball TBGA 2. Part number(TBGA package part number) is changed - K9F6408Q0C-D ----> K9F6408Q0C-B - K9F6408U0C-D -----> K9F6408U0C-B 3. K9F6408U0C-BCB0,BIB0 products are added 0.3 1. WSOP1 package is added. - Part number : K9F6408U0C_VCB0,VIBO 1. Add the Rp vs tr ,tf & Rp vs ibusy graph for 1.8V device (Page 28) 2. Add the data protection Vcc guidence for 1.8V device - below about 1.1V. (Page 29) The min. Vcc value 1.8V devices is changed. K9F64XXQ0C : Vcc 1.65V~1.95V --> 1.70V~1.95V Pb-free Package is added. K9F6408U0C-QCB0,QIB0 K9F6408U0C-HCB0,HIB0 K9F6408Q0C-HCB0,HIB0 K9F6408U0C-FCB0,FIB0 Note is added. (VIL can undershoot to -0.4V and VIH can overshoot to VCC +0.4V for durations of 20 ns or less.) 1. Add the Protrusion/Burr value in WSOP1 PKG Diagram. 1. PKG(WSOP1) Dimension Change Mar. 13 . 2002 Nov. 12 . 2001 Draft Date Jul. 24 . 2001 Nov. 5 . 2001 Remark Advance Preliminary 0.4 Nov. 21. 2002 0.5 Mar. 05. 2003 0.6 Mar. 13 . 2003 0.7 Jul. 04. 2003 0.8 0.9 Apr. 24. 2004 May. 24. 2004 Note : For more detailed features and specifications including .


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