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ISL9N308AP3

Fairchild Semiconductor

N-Channel Logic Level UltraFET Trench MOSFETs 30V/ 75A/ 8m

ISL9N308AP3/ISL9N308AS3ST January 2002 PWM Optimized ISL9N308AP3/ISL9N308AS3ST N-Channel Logic Level UltraFET® Trench...


Fairchild Semiconductor

ISL9N308AP3

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ISL9N308AP3/ISL9N308AS3ST January 2002 PWM Optimized ISL9N308AP3/ISL9N308AS3ST N-Channel Logic Level UltraFET® Trench MOSFETs 30V, 75A, 8mΩ General Description This device employs a new advanced trench MOSFET technology and features low gate charge while maintaining low on-resistance. Optimized for switching applications, this device improves the overall efficiency of DC/DC converters and allows operation to higher switching frequencies. Features Fast switching rDS(ON) = 0.0064Ω (Typ), VGS = 10V rDS(ON) = 0.010Ω (Typ), VGS = 4.5V Qg (Typ) = 24nC, VGS = 5V Qgd (Typ) = 8nC CISS (Typ) = 2600pF Applications DC/DC converters DRAIN (FLANGE) SOURCE DRAIN GATE D GATE SOURCE G DRAIN (FLANGE) S TO-263AB TO-220AB MOSFET Maximum Ratings TC = 25°C unless otherwise noted Symbol VDSS VGS Parameter Drain to Source Voltage Gate to Source Voltage Drain Current Continuous (TC = 25oC, VGS = 10V) Continuous (TC = 100oC, VGS = 4.5V) Continuous (TC = 25oC, VGS = 10V, RθJC = 43oC/W) Pulsed Power dissipation Derate above 25oC Operating and Storage Temperature Ratings 30 ±20 75 48 15 Figure 4 100 0.67 -55 to 175 Units V V A A A A W W/oC oC ID PD TJ, TSTG Thermal Characteristics RθJC RθJA RθJA Thermal Resistance Junction to Case TO-220, TO-263 Thermal Resistance Junction to Ambient TO-220, TO-263 Thermal Resistance Junction to Ambient TO-263, 1in2 copper pad area 1.5 62 43 oC/W oC/W oC/W Package Marking and Ordering Information Device Marking N308AS N308AP Device ISL9N308AS3S...




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