IRF6618/IRF6618TR1
VDSS
Application Specific MOSFETs Ideal for CPU Core DC-DC Converters l Low Conduction Losses l Low S...
IRF6618/IRF6618TR1
VDSS
Application Specific
MOSFETs Ideal for CPU Core DC-DC Converters l Low Conduction Losses l Low Switching Losses l Low Profile (<0.7 mm) l Dual Sided Cooling Compatible l Compatible with existing Surface Mount Techniques
l l
PD - 94726D
HEXFET® Power
MOSFET
RDS(on) max
2.2mΩ@VGS = 10V 3.4mΩ@VGS = 4.5V
Qg
43 nC
30V
MT
Applicable DirectFET Package/Layout Pad (see p.8,9 for details)
DirectFET ISOMETRIC
SQ
SX
ST
MQ
MX
MT
Description
The IRF6618 combines the latest HEXFET® Power
MOSFET Silicon technology with the advanced DirectFET TM packaging to achieve the lowest on-state resistance in a package that has the footprint of an SO-8 and only 0.7 mm profile. The DirectFET package is compatible with existing layout geometries used in power applications, PCB assembly equipment and vapor phase, infra-red or convection soldering techniques, when application note AN-1035 is followed regarding the manufacturing methods and processes. The DirectFET package allows dual sided cooling to maximize thermal transfer in power systems, IMPROVING previous best thermal resistance by 80%. The IRF6618 balances both low resistance and low charge along with ultra low package inductance to reduce both conduction and switching losses. The reduced total losses make this product ideal for high efficiency DC-DC converters that power the latest generation of processors operating at higher frequencies. The IRF6618 has been optimized for parameters that are critical in sync...