l Ultra Low On-Resistance l P-Channel MOSFET l Surface Mount l Available in Tape & Reel l Low Gate Charge l Lead-Free l ...
l Ultra Low On-Resistance l P-Channel
MOSFET l Surface Mount l Available in Tape & Reel l Low Gate Charge l Lead-Free l Halogen-Free
Description
These P-channel HEXFET® Power
MOSFETs from International Rectifier utilize advanced processing techniques to achieve the extremely low on-resistance per silicon area. This benefit provides the designer with an extremely efficient device for use in battery and load management applications.
The TSOP-6 package with its customized leadframe produces a HEXFET® power
MOSFET with RDS(on) 60% less than a similar size SOT-23. This package is ideal for applications where printed circuit board space is at a premium. It's unique thermal design and RDS(on) reduction enables a current-handling increase of nearly 300% compared to the SOT-23.
VDSS
-40V
PD - 95503B
IRF5804PbF
HEXFET® Power
MOSFET
RDS(on) max (mW)
198@VGS = -10V
334@VGS = -4.5V
ID
-2.5A
-2.0A
D1
6
A D
D2
5D
G3
4S
Top View
TSOP-6
Absolute Maximum Ratings
Parameter
VDS
ID @ TA = 25°C ID @ TA= 70°C IDM PD @TA = 25°C PD @TA = 70°C
Drain- Source
Voltage
Continuous Drain Current, VGS @ -10V Continuous Drain Current, VGS @ -10V Pulsed Drain Current
Power Dissipation Power Dissipation Linear Derating Factor
VGS TJ, TSTG
Gate-to-Source
Voltage Junction and Storage Temperature Range
Max. -40 -2.5 -2.0 -10 2.0 1.3 0.016 ± 20 -55 to + 150
Units V
A
W mW/°C
V °C
Thermal Resistance
RθJA
www.irf.com
Parameter Maximum Junction-to-Ambient
Max. 62.5
Units °C/W
1
04/20/...