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GS816272C

Part Number	GS816272C
Manufacturer	GSI Technology
Description	18Mb Sync Burst SRAMs
Published	May 29, 2019
Detailed Description	GS816272C 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb Sync Burst SRAMs 200 MHz–133 MHz 2.5 V or 3.3 V...
Datasheet	GS816272C PDF File

Overview

GS816272C 209-Bump BGA Commercial Temp Industrial Temp 256K x 72 18Mb Sync Burst SRAMs 200 MHz–133 MHz 2.
5 V or 3.
3 V VDD 2.
5 V or 3.
3 V I/O Not Recommended for New Design—Discontinued Product Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.
1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 2.
5 V or 3.
3 V +10%/–10% core power supply • LBO pin for Linear or Interleaved Burst mode • Internal input resistors on mode pins allow floating mode pins • Byte Write (BW) and/or Global Write (GW) operation • Internal self-timed write cycle • Automatic power-down for portable applica...

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