(DSEA16-06AC / DSEC16-06AC) HiPerDynFREDTM Epitaxial Diode ISOPLUS220TM
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ADVANCE TECHNICAL INFORMATION
HiPerDynFREDTM Epitaxial Diode
ISOPLUS220TM
Electrically Isolated Ba...
Description
www.DataSheet4U.com
ADVANCE TECHNICAL INFORMATION
HiPerDynFREDTM Epitaxial Diode
ISOPLUS220TM
Electrically Isolated Back Surface
DSEA
IFAV VRRM trr
DSEA 16-06AC DSEC 16-06AC = 2x8 A = 600 V = 35 ns
VRSM V 600 600
VRRM V 600 600
Type
1 DSEC 2 3
ISOPLUS220TM
1 2 3 Isolated back surface * 1 2 3 * Patent pending
DSEA 16-06AC DSEC 16-06AC
Symbol IFRMS IFAVM IFSM EAS IAR TVJ TVJM Tstg TL Ptot VISOL FC Weight
Conditions TC = 120°C; rectangular, d = 0.5 TVJ = 45°C; tp = 10 ms (50 Hz), sine TVJ = 25°C; non-repetitive IAS = 0.9 A; L = 180 µH VA = 1.5·VR typ.; f = 10 kHz; repetitive
Maximum Ratings 35 8 50 0.1 0.1 -55...+175 175 -55...+150 A A A mJ A °C °C °C °C W V~ N / lb g Applications
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Features
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1.6 mm (0.063 in) from case for 10 s TC = 25°C 50/60 Hz RMS; IISOL £ 1 mA mounting force with clip typical
260 50 2500 11...65 / 2.5...15 2
Silicon chip on Direct-Copper-Bond substrate - High power dissipation - Isolated mounting surface - 2500V electrical isolation Low cathode to tab capacitance (<15pF) Planar passivated chips Very short recovery time Extremely low switching losses Low IRM-values Soft recovery behaviour Epoxy meets UL 94V-0
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Symbol IR
Conditions TVJ = 25°C VR = VRRM TVJ = 150°C VR = VRRM IF = 10 A; TVJ = 150°C TVJ = 25°C
Characteristic Values typ. max. 60 0.25 1.42 2.10 3 0.6 35 3.5 4.4 µA mA V V
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VF RthJC RthCH trr
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