Low Insertion loss : 0.30 dB (typ.) @800 MHz 0.35 dB (typ.) @2 GHz 0.40 dB (typ.) @2.7 GHz
No DC Blocking Capacitors (except sourcing DC bias) Solder Bump Bare Die(SBBD) : Bump Pitch = 0.4 mm Small Flip-Chip Size : 1.5 mm x 1.5 mm x 0.35 mm Typ.Lead...
CXA2947GC PDF File
