PROCESS
5 Volt TVS Chip
CPZ40X
Transient Voltage Suppressor
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Area Top Side Metalization Back Side Metalization 13.4 x 13.4 MILS 5.5 MILS 3.9 x 6.7 MILS Al - 30,000Å Au - 9,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 122,493 PRINCIPAL DEVICE TYPE CMO5V0LC
R0 (9-January 2013)
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