PROCESS
CPZ39R
Transient Voltage Suppressor
5 Volt Quad TVS Chip
PROCESS DETAILS Die Size Die Thickness Cathode Bonding Pad Areas (4) Top Side Metalization Back Side Metalization 11 x 11 MILS 3.94 MILS 3.54 MILS DIAMETER EACH Al - 30,000Å Au - 9,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 140,490 PRINCIPAL DEVICE TYPE CMNTVS5V0
R0 (22-January 2013)
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