Silicon Controlled Rectifier 25 Amp Sensitive Gate SCR Chip
PROCESS
CPS150
Silicon Controlled Rectifier
25 Amp Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thick...
Description
PROCESS
CPS150
Silicon Controlled Rectifier
25 Amp Sensitive Gate SCR Chip
PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization
www.DataSheet4U.com
Glass Passivated Mesa 150 x 150 MILS 8.7 MILS 117 x 84 MILS 24 x 24 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å
GEOMETRY
GROSS DIER PER 4 INCH WAFER 466 PRINCIPAL DEVICE TYPES CS220-25M Series CSDD-25M Series
145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com
R0 (4- January 2006)
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