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CPS053 Datasheet

Part Number CPS053
Manufacturers Central Semiconductor
Logo Central Semiconductor
Description Silicon Controlled Rectifier Sensitive Gate SCR Chip
Datasheet CPS053 DatasheetCPS053 Datasheet (PDF)

PROCESS CPS053 Silicon Controlled Rectifier 2.0 Amp Sensitive Gate SCR Chip PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization www.DataSheet4U.com Glass Passivated Mesa 53 x 53 MILS 8.7 MILS 20 x 10 MILS 7.9 x 7.9 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å GEOMETRY GROSS DIER PER 4 INCH WAFER 3,884 PRINCIPAL DEVICE TYPES CS92-2M Series CS223-2M Series MCR22-6 Series 145 Adams Avenue Hauppauge, NY 11788 US.

  CPS053   CPS053






Part Number CPS057
Manufacturers Central Semiconductor
Logo Central Semiconductor
Description Silicon Controlled Rectifier Sensitive Gate SCR Chip
Datasheet CPS053 DatasheetCPS057 Datasheet (PDF)

PROCESS CPS057 Silicon Controlled Rectifier Sensitive Gate SCR Chip PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization www.DataSheet4U.com GLASS PASSIVATED MESA 57 x 57 MILS 8.7 MILS ± 0.6 MILS 24 x 14 MILS 7.9 x 7.9 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å GEOMETRY GROSS DIE PER 4 INCH WAFER 3,374 PRINCIPAL DEVICE TYPES CS39-4D 2N2323 thru 2N2329 CS223-4M BACKSIDE ANODE 145 Adams Avenue Hauppauge, NY 11.

  CPS053   CPS053







Part Number CPS05641AB
Manufacturers Wuxi Compul Electronics
Logo Wuxi Compul Electronics
Description Display
Datasheet CPS053 DatasheetCPS05641AB Datasheet (PDF)

Wuxi Compul Electronics Co,.Ltd Mail: [email protected] Web: www.compul.cn Tel: 86 510 87359088 Fax: 86 510 87359268 CPS05641AB Package Dimensions Internal Circuit Diagram 5641A Four Digits Displays Series 5641B .

  CPS053   CPS053







Silicon Controlled Rectifier Sensitive Gate SCR Chip

PROCESS CPS053 Silicon Controlled Rectifier 2.0 Amp Sensitive Gate SCR Chip PROCESS DETAILS Process Die Size Die Thickness Cathode Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization www.DataSheet4U.com Glass Passivated Mesa 53 x 53 MILS 8.7 MILS 20 x 10 MILS 7.9 x 7.9 MILS Al - 45,000Å Al/Mo/Ni/Ag - 32,000Å GEOMETRY GROSS DIER PER 4 INCH WAFER 3,884 PRINCIPAL DEVICE TYPES CS92-2M Series CS223-2M Series MCR22-6 Series 145 Adams Avenue Hauppauge, NY 11788 USA Tel: (631) 435-1110 Fax: (631) 435-1824 www.centralsemi.com R0 (4- January 2006) .


2008-04-16 : DO214-AA    AU6370    AU6372    UT351-xA    V53C16258SH    CPS041    CPS053    CPS057    CPS0827    CPS090   


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