PROCESS
TRIAC
CPQ090
4.0 Amp, 600 Volt TRIAC Chip
www.DataSheet4U.com
PROCESS DETAILS Process Die Size Die Thickness MT1 Bonding Pad Area Gate Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 1,310 PRINCIPAL DEVICE TYPES 2N6075A CQ202-4MS CQ223-4M CQD-4M Glass Passivated Mesa 90 x 90 MILS 8.6 MILS ± 0.6 MIL...
