CPD94X

PROCESS CPD94X Schottky Diode 0.5 Amp Schottky Diode Chip PROCESS DETAILS Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization 20 x 20 MILS 5.9 MILS 16 x 16 MILS Al - 20,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 42,213 PRINCIPAL DEVICE TYPES CMDSH05-4 CMLSH05-4 CMPSH05-4 R0 (19-July 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD94X Typical Electrical Characteristics R0 (19-July 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com ...