CPD87R

PROCESS CPD87R Schottky Diode Low Leakage Schottky Diode Chip PROCESS DETAILS Process Die Size Die Thickness Anode Bonding Pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 14.6 x 14.6 MILS 3.9 MILS 11.8 x 11.8 MILS Al - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 5 INCH WAFER 80,698 PRINCIPAL DEVICE TYPES CFSH2-4L R1 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com PROCESS CPD87R Typical Electrical Characteristics R1 (22-March 2010) w w w. c e n t r a l s e m i . c o m http://www.Datasheet4U.com ...