PROCESS
Small Signal Transistor
CP788X
PNP - Low Noise Amplifier Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 5 INCH WAFER 91,469 PRINCIPAL DEVICE TYPE CMKT5087 EPITAXIAL PLANAR 13.7 x 13.7 MILS 5.9 MILS 4.0 x 4.0 MILS 5.5 ...
