Small Signal Transistor NPN - Amp/Switch Transistor Chip
Description
PROCESS
Small Signal Transistor
CP191V
NPN - Amp/Switch Transistor Chip
PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 41,699 PRINCIPAL DEVICE TYPES CMLT2222A CMLT2207 CMLM2205 CMKT2207 EPITAXIAL PLANAR 16.5 x 16.5 MILS 7.1 MILS...
