(AS7C33512NTF32A / AS7C33512NTF36A) 3.3V 512K x 32/36 Flowthrough Synchronous SRAM
April 2005
®
AS7C33512NTF32A AS7C33512NTF36A
3.3V 512K × 32/36 Flowthrough Synchronous SRAM with NTDTM
Features
• Orga...
April 2005
®
AS7C33512NTF32A AS7C33512NTF36A
3.3V 512K × 32/36 Flowthrough Synchronous SRAM with NTDTM
Features
Organization: 524,288 words × 32 or 36 bits NTD™architecture for efficient bus operation Fast clock to data access: 7.5/8.5/10 ns Fast OE access time: 3.5/4.0 ns Fully synchronous operation Flow-through mode Asynchronous output enable control Available in 100-pin TQFP package www.DataSheet4U.com Individual byte write and global write
Clock enable for operation hold Multiple chip enables for easy expansion 3.3V core power supply 2.5V or 3.3V I/O operation with separate VDDQ Self-timed write cycles Interleaved or linear burst modes Snooze mode for standby operation
Logic block diagram
A[18:0] 19 D
Address register Burst logic
Q
19
CLK CE0 CE1 CE2 R/W BWa BWb BWc BWd ADV / LD LBO ZZ
D
Q 19
Write delay addr. registers
CLK
Control logic
CLK
Write Buffer
CLK
512K x 32/36 SRAM Array
DQ[a,b,c,d]
32/36
D
Data Q Input Register
CLK
32/36 32/36 32/36
32/36 CLK CEN OE
Output Buffer
32/36 OE
DQ[a,b,c,d]
Selection guide
-75 Minimum cycle time Maximum clock access time Maximum operating current Maximum standby current Maximum
CMOS standby current (DC) 8.5 7.5 275 90 60 -85 10 8.5 250 80 60 -10 12 10 230 80 60 Units ns ns mA mA mA
4/21/05, v 1.3
Alliance Semiconductor
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AS7C33512NTF32A/36A
®
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