AGN21xxx

GN TESTING ULTRA-SMALL PACKAGE SLIM POLARIZED RELAY GN-RELAYS Due to highly efficient magnetic circuit design, leakage flux is reduced and changes in electrical characteristics from components being mounted close-together are minimized. This all means a packaging density higher than ever before. Nominal operating power: 140 mW Outstanding vibration and shock resistance. Functional shock resistance: 750 m/s2 {75G} Destructive shock resistance: 1,000 m/s2 {100G} Functional vibration resistance: 10 to 55 Hz (at double amplitude of 3.3 mm .130 inch) Destructive vibration resistance: 10 to 55 Hz (at double amplitude of 5 mm .197 inch) FEATURES 10.60±0.3 .417±.012 5.70±0.3 .224±.012 9.00±0.3 .354±.012 10.60±0.3 .417±.012 5.70±0.3 .224±.012 Max.10.00 .394 Compact slim body saves space Thanks to the small surface area of 5.7 mm × 10.6 mm .224 inch × .417 inch and low height of 9.0 mm .354 inch, the packaging density can be increased to allow for much smaller designs. Outstanding surge resistance. Surge withstand between open contacts: 1,500 V 10×160 µs (FCC part 68) Surge withstand between contacts and coil: 2,500 V 2×10 µs (Bellcore) The use of twin crossbar contacts ensures high contact reliability. AgPd contact is used because of its good sulfide resistance. Adopting low-gas molding material. Coil assembly molding technology which avoids generating volatile gas from coil. Increased packaging density mm inch SPECIFICATIONS Contact Arrangement Initial contact resist...