PRODUCT INFORMATION
840nm
4D470
PIN Array
Parallel Datacom, Telecom
PRE
LI
/ RY A N MI
This device consists of a ...
PRODUCT INFORMATION
840nm
4D470
PIN Array
Parallel Datacom, Telecom
PRE
LI
/ RY A N MI
This device consists of a 4-channel PIN Photodiode array in a miniature surface-mountable MT package. It is based on a unique combination of selfalignment technology and direct optical coupling to fiber, resulting in optimum coupling efficiency without need for active alignment. Applications include parallel Fibre Channel and optical interconnect inter/intra-board. And it matches the 4D469 VCSEL Array.
Optical and Electrical Characteristics
PARAMETER SYMBOL MIN. TYP . MAX. UNIT
(25° C Case Temperature) TEST CONDITION
Responsivity Bandwidth (3dBel ) Capacitance Dark Current Crosstalk
R fc C Id X
0.45 2 1 0.4 -30
A/W GHz pF nA dBel
=850nm RL=50⍀ f=1MHz
=850nm (Note 1)
Test Condition: VR=3.3V or 5V. Fiber Ribbon: 50/125 GI, NA=0.2 or 62.5/125 GI, NA=0.275. Note 1: Crosstalk between adjacent channels operating at 2GHz.
Absolute Maximum Ratings
PARAMETER SYMBOL LIMIT
Storage Temperature Operating Temperature Reverse
Voltage Soldering Temperature (2mm from the case for 10 sec)
Tstg Top VR Tsld
-40 to +85Њ C 0 to +70Њ C 20V 260ЊC
Thermal Characteristics
PARAMETER
METAL SHIELD
SYMBOL
MIN.
TYP.
MAX.
UNIT
Temperature Coefficient - Dark Current
dId/dTj
5
%/ЊC
CATHODE
CATHODE
ANODES
FRONT VIEW
METAL SHIELD
HEAT SINK
MT GUIDE PINS
LEADS
SIDE VIEW
The cathode is connected to the metal shield
PIN Array in MT Package
13628.11 1999-01-13
All dimensions in mm
Eur...