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25Q64FW

Winbond

W25Q64FW

W25Q64FW 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: March 25, 2013 Preliminary ...


Winbond

25Q64FW

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W25Q64FW 1.8V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: March 25, 2013 Preliminary - Revision D W25Q64FW Table of Contents 1. GENERAL DESCRIPTIONS............................................................................................................. 5 2. FEATURES....................................................................................................................................... 5 3. PACKAGE TYPES AND PIN CONFIGURATIONS .......................................................................... 6 3.1 Pin Configuration SOIC / VSOP 208-mil .............................................................................. 6 3.2 Pad Configuration WSON 6x5-mm / 8x6-mm ...................................................................... 6 3.3 Pin Description SOIC/VSOP 208-mil, WSON 6x5-mm / 8x6-mm ........................................ 6 3.4 Pin Configuration SOIC 300-mil ........................................................................................... 7 3.5 Pin Description SOIC 300-mil............................................................................................... 7 3.6 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array)................................................. 8 3.7 Ball Description TFBGA 8x6-mm ......................................................................................... 8 3.8 Ball Configuration WLBGA ..........................................................................




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