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BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 216 SERIES Standard P/N 216-40CT 216-40CTT 216-40CTR Surface Mount Heat Sinks Height Above PC Board .390 in. (9.9) .390 in. (9.9) .390 in. (9.9) Footprint Dimensions .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) .600 in. (15.2) x .740 in. (18.8) Package Format Bulk Tube Tape & Reel Package Quantity 1 25 250 D 2PAK, TO-220, SOL-20 Thermal Performance at Typical Load Natural Convection Forced Convection 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM PATENT 361317 Increase the power dissipation level of D2PAK, TO-220, SOL-20 and other surface mount power components while maintaining the benefits of high-speed, automated pick and place assembly technology. The patented 216 Series heat sink is mounted astride the component and solder reflowed to the PCB using standard board assembly equipment (Fuji, Philips, etc.) and processes. This creates a very low thermal resistance path from the component tab to the heat sink and in turn to the ambient air which lowers junction temperatures for reliable operation. Available in bulk, tube or tape & reel packaging which meet EIA Standards and ESD protection requirements. Material: Copper, tin-lead plated. 216-40CTR A RECOMMENDED COPPER FOOTPRINT USE MAX COPPER TO ALLOW MAX CONDUCTION TO HEAT SINK .660 (16.8) .640 (16.3) .660 (16.8) .640 (16.3) COPPER FOOTPRINT FOR HEAT SINK MIN COPPER FOR HEAT SINK 1.260 (32.0) .3...