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Si5481DU

Vishay
Part Number Si5481DU
Manufacturer Vishay
Description P-Channel MOSFET
Published Dec 18, 2015
Detailed Description New Product P-Channel 20-V (D-S) MOSFET Si5481DU Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.022 at VGS ...
Datasheet PDF File Si5481DU PDF File

Si5481DU
Si5481DU

Overview
New Product P-Channel 20-V (D-S) MOSFET Si5481DU Vishay Siliconix PRODUCT SUMMARY VDS (V) RDS(on) (Ω) 0.
022 at VGS = - 4.
5 V - 20 0.
029 at VGS = - 2.
5 V 0.
041 at VGS = - 1.
8 V ID (A) - 12a - 12a - 12a PowerPAK ChipFET Single 1 2 D3 DD 4 8D 7D 6S D G S 5 Qg (Typ.
) 20 nC FEATURES • Halogen-free • TrenchFET® Power MOSFET • New thermally Enhanced PowerPAK® ChipFET® Package - Small Footprint Area - Low On-Resistance - Thin 0.
8 mm Profile RoHS COMPLIANT APPLICATIONS • Load Switch, Battery Switch, PA Switch and Charger Switch for Portable Devices S Marking Code BC XXX Lot Traceability and Date Code Part # Code G Bottom View Ordering Information: Si5481DU-T1-GE3 (Lead (Pb)-free and Halogen-free) ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS TC = 25 °C Continuous Drain Current (TJ = 150 °C) TC = 70 °C TA = 25 °C ID Pulsed Drain Current TA = 70 °C IDM Continuous Source-Drain Diode Current TC = 25 °C TA = 25 °C IS TC = 25 °C Maximum Power Dissipation TC = 70 °C TA = 25 °C PD Operating Junction and Storage Temperature Range Soldering Recommendations (Peak Temperature)d, e TA = 70 °C TJ, Tstg D P-Channel MOSFET Limit - 20 ±8 - 12a - 12a - 9.
7b, c - 7.
8b, c - 20 - 14.
8 - 2.
6b, c 17.
8 11.
4 3.
1b, c 2b, c - 55 to 150 260 Unit V A W °C THERMAL RESISTANCE RATINGS Parameter Maximum Junction-to-Ambientb, f Maximum Junction-to-Case (Drain) t≤5s Steady State Symbol RthJA RthJC Typical 30 5.
5 Maximum 40 7 Unit °C/W Notes: a.
Package limited.
b.
Surface mounted on 1" x 1" FR4 board.
c.
t = 5 s.
d.
See Solder Profile (http://www.
vishay.
com/ppg?73257).
The PowerPAK ChipFET is a leadless package.
The end of the lead terminal is exposed copper (not plated) as a result of the singulation process in manufacturing.
A solder fillet at the exposed copper tip cannot be guaranteed and is not required to ensure adequate bottom side solder interconnection.
e.
Rework Co...


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