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SP8M51

Rohm

4V Drive Nch + Pch MOSFET - Rohm


SP8M51
SP8M51

PDF File SP8M51 PDF File



Description
Data Sheet 4V Drive Nch + Pch MOSFET SP8M51  Structure Silicon N-channel MOSFET/ Silicon P-channel MOSFET Dimensions (Unit : mm) SOP8 Features 1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small Surface Mount Package (SOP8).
(8) (5) (1) (4)  Application Switching Inner circuit  Packaging specifications (8) (7) (6) (5) Type SP8M51 Package Code Basic ordering unit (pieces) Taping TB 2500   Absolute maximum ratings (Ta = 25C) (1) Tr1 Source (2) Tr1 Gate (3) Tr2 Source (4) Tr2 Gate (5) Tr2 Drain (6) Tr2 Drain (7) Tr1 Drain (8) Tr1 Drain ∗2 ∗2 ∗1 ∗1 (1) (2) (3) (4) ∗1 ESD PROTECTION DIODE ∗2 BODY DIODE Parameter Drain-source voltage Gate-source voltage Drain current Source current (Body Diode) Continuous Pulsed Continuous Pulsed Total power dissipation Channel temperature Range of storage temperature Symbol Limits Tr1 : N-ch Tr2 : P-ch Unit VDSS VGSS ID IDP *1 Is Isp *1 100 ±20 3.
0 12 1.
0 12 100 ±20 2.
5 10 1.
0 10 V V A A A A PD *2 2.
0 W / TOTAL 1.
4 W / ELEMENT Tch 150 Tstg 55 to 150 C C *1 Pw10s, Duty cycle1% *2 Mounted on a ceramic board.
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1/10 2011.
02 - Rev.
A SP8M51  Electrical characteristics (Ta = 25C) Parameter Symbol Gate-source leakage IGSS Drain-source breakdown voltage V (BR)DSS Zero gate voltage drain current IDSS Gate threshold voltage VGS (th) Static drain-source on-state resistance RDS * (on) Forward transfer admittance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge *Pulsed l Yfs l * Ciss Coss Crss td(on) * tr * td(off)* tf * Qg * Qgs * Qgd * Min.
- 100 - 1.
0 - 3.
5 - Typ.
- 120 130 135 610 55 35 13 13 50 14 8.
5 1.
8 3.
5 Body diode characteristics (Source-Drain) (Ta = 25C) Parameter Symbol Min.
Typ.
Forward Voltage VSD * - - *Pulsed Max.
10 1 2.
5 170 180 190 -...



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