PD-95291
IRF7807VD2PbF
FETKY MOSFET / SCHOTTKY DIODE
• Co-Pack N-channel HEXFET® Power MOSFET
and Schottky Diode • Ideal for Synchronous Rectifiers in DC-DC
A/S 1
8 K/D
Converters Up to 5A Output • Low Conduction Losses • Low Switching Losses
A/S 2 A/S 3
7 K/D 6 K/D
• Low Vf Schottky Rectifier • Lead-Free
G4
5 K/D D
Description
SO-8
Top View
The FETKY™ family of Co-Pack HEXFET®MOSFETs and
Schottky diodes offers the designer an innovative, board
space saving solution for switching regulator and power
management applications. HEXFET power MOSFETs utilize advanced processing techniques to achieve
DEVICE CHARACTERISTICS
extremely low on-resistance per silicon area. Combining this technology with International Rectifier’s low forward drop Schottky rectifiers results in an extremely efficient device suitable for use in a wide variety of portable electronics applications.
The SO-8 has been modified through a customized leadframe for enhanced thermal characteristics. The SO-
RDS(on) Q
G
Qsw Qoss
IRF7807VD2 17mΩ 9. 5nC 3. 4nC 12nC
8 package is designed for vapor phase, infrared or wave
soldering techniques.
Absolute Maximum Ratings
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain or Source
25°C
Current (VGS ≥ 4. 5V) Pulsed Drain Current
70°C
Power Dissipation
25°C
70°C
Schottky and Body Diode
25°C
Average ForwardCurrent
70°C
Junction & Storage Temperature Range
Symbol V
DS
VGS ID
IDM PD
IF (AV)
TJ, TSTG
Max. 30 ±20 8. 3 6. 6 66 2. 5 1. 6 3. 7 2. 3
–55 to 150
Units V
A
W A °C
Thermal Resistance Parameter Maximum Junction-to-Ambient Maximum Junction-to-Lead
www. irf. com
RθJA RθJL
Max. 50 20
Units °C/W °C/W
1
10/08/04
IRF7807VD2PbF
Electrical Characteristics
Parameter
Drain-to-Source Breakdown Voltage
BVDSS
Static Drain-Source on Resistance
Gate Threshold Voltage
Drain-Source Leakage CCuurrrreennt t*
RDS(on)
VGS(th) IDSS
Min Typ 30 –
17
1. 0
Max Units –V
25 mΩ
V 50 µA 6. 0 mA
Gate-Source Leakage Current* Tota...