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MB1608xxxx5x

ABC Taiwan Electronics
Part Number MB1608xxxx5x
Manufacturer ABC Taiwan Electronics
Title MULTILAYER CHIP BEAD
Description SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS...
Features 0¢J / sec max. Forced Cooling Area -(1.0 ~ 5.0)¢J / sec max. Peak Temperature: 260¢J 230¢J 30±5 200 150 70sec max. ...
Published Jun 5, 2011
Datasheet PDF File MB1608xxxx5x PDF File


MB1608xxxx5x
MB1608xxxx5x


Features
0¢J / sec max. Forced Cooling Area -(1.0 ~ 5.0)¢J / sec max. Peak Temperature: 260¢J 230¢J 30±5 200 150 70sec max. ¡ G Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5¢J Flux : Rosin Dip time : 4±1 seconds ) 100 50 0 50 100 ...



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