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CP757X

Central Semiconductor
Part Number CP757X
Manufacturer Central Semiconductor
Description P-Channel MOSFET
Published Jun 3, 2011
Detailed Description PROCESS Small Signal MOSFET Transistor P-Channel Enhancement-Mode MOSFET Chip CP757X www.DataSheet4U.com PROCESS DET...
Datasheet PDF File CP757X PDF File

CP757X
CP757X

Overview
PROCESS Small Signal MOSFET Transistor P-Channel Enhancement-Mode MOSFET Chip CP757X www.
DataSheet4U.
com PROCESS DETAILS Die Size Die Thickness Gate Bonding Pad Area Source Bonding Pad Area Top Side Metalization Back Side Metalization 22 x 17 MILS 5.
9 MILS 3.
9 x 3.
9 MILS 14 x 9 MILS Al-Si - 30,000Å Au - 12,000Å GEOMETRY GROSS DIE PER 6 INCH WAFER 63,570 PRINCIPAL DEVICE TYPE CMLDM5757 R0 (2-December 2010) w w w.
c e n t r a l s e m i .
c o m PROCESS CP757X Typical Electrical Characteristics R0 (2-December 2010) w w w.
c e n t r a l s e m i .
c o m ...


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