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CP317

Central Semiconductor
Part Number CP317
Manufacturer Central Semiconductor
Description Small Signal Transistor NPN - RF Transistor Chip
Published Apr 1, 2011
Detailed Description PROCESS Small Signal Transistor NPN - RF Transistor Chip CP317 PROCESS DETAILS Process Die Size Die Thickness Base Bo...
Datasheet PDF File CP317 PDF File

CP317
CP317


Overview
PROCESS Small Signal Transistor NPN - RF Transistor Chip CP317 PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 53,788 PRINCIPAL DEVICE TYPES CMPT918 2N918 2N2857 2N5179 2N5770 BFY90 PN3563 PN3564 BACKSIDE COLLECTOR EPITAXIAL PLANAR 14.
5 x 14.
5 MILS 9.
0 MILS 2.
4 x 2.
2 MILS 2.
4 x 2.
2 MILS Al - 30,000Å Au - 18,000Å R3 (22-March 2010) w w w.
c e n t r a l s e m i .
c o m www.
DataSheet4U.
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c e n t r a l s e m i .
c o m www.
DataSheet4U.
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