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CP309

Part Number	CP309
Manufacturer	Central Semiconductor
Description	Power Transistor NPN - Low Saturation Transistor Chip
Published	Apr 1, 2011
Detailed Description	PROCESS Power Transistor CP309 NPN - Low Saturation Transistor Chip PROCESS DETAILS Process Die Size Die Thickness B...
Datasheet	CP309 PDF File

Overview

PROCESS Power Transistor CP309 NPN - Low Saturation Transistor Chip PROCESS DETAILS Process Die Size Die Thickness Base Bonding Pad Area Emitter Bonding Pad Area Top Side Metalization Back Side Metalization GEOMETRY GROSS DIE PER 4 INCH WAFER 6,285 PRINCIPAL DEVICE TYPES CMPT3090L CXT3090L CZT3090L CMXT3090L EPITAXIAL PLANAR 41.
3 x 41.
3 MILS 9.
0 MILS 9.
4 x 9.
2 MILS 12.
8 x 10.
2 MILS Al - 30,000Å Ag - 12,000Å E B BACKSIDE COLLECTOR R1 R4 (22-March 2010) w w w.
c e n t r a l s e m i .
c o m com PROCESS CP309 Typical Electrical Characteristics R4 (22-March 2010) w w w.
c e n t r a l s e m i .
c o m com ...

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