SPI Real time clock/calendar - NXP Semiconductors
Description
PCF2123
SPI Real time clock/calendar
Rev.
6 — 15 July 2013
Product data sheet
1.
General description
The PCF2123 is a CMOS1 Real-Time Clock (RTC) and calendar optimized for low power applications.
Data is transferred serially via a Serial Peripheral Interface (SPI-bus) with a maximum data rate of 6.
25 Mbit/s.
An alarm and timer function is also available providing the possibility to generate a wake-up signal on an interrupt pin.
An offset register allows fine tuning of the clock.
2.
Features and benefits
Real time clock provides year, month, day, weekday, hours, minutes, and seconds based on a 32.
768 kHz quartz crystal
Low backup current while running: typical 100 nA at VDD = 2.
0 V and Tamb = 25 C Resolution: seconds to years Watchdog functionality Freely programmable timer and alarm with interrupt capability Clock operating voltage: 1.
1 V to 5.
5 V 3 line SPI-bus with separate, but combinable data input and output Serial interface at VDD = 1.
8 V to 5.
5 V 1 second or 1 minute interrupt output Integrated oscillator load capacitors for CL = 7 pF Internal Power-On Reset (POR) Open-drain interrupt and clock output pins Programmable offset register for frequency adjustment
3.
Applications
Time keeping application Battery powered devices Metering High duration timers Daily alarms Low standby power applications
1.
The definition of the abbreviations and acronyms used in this data sheet can be found in Section 22.
NXP Semiconductors
PCF2123
SPI Real time clock/calendar
4.
Ordering information
Table 1.
Ordering information
Type number
Package
Name
PCF2123BS
HVQFN16
PCF2123TS
TSSOP14
PCF2123U/10AA PCF2123U/12AA PCF2123U/12HA PCF2123U/5GA
wire bond die WLCSP12 WLCSP12 wire bond die
Description plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 3 0.
85 mm plastic thin shrink small outline package; 14 leads; body width 4.
4 mm 12 bonding pads wafer level chip size package; 12 bumps wafer l...
Similar Datasheet
