LED - Chip - EPIGAP optoelectronic GmbH
Description
Preliminary
LED - Chip
Radiation Blue Type Standard
10.
04.
2007 Technology InGaN/Al2O3
rev.
01/07 www.
DataSheet4U.
com Electrodes Both on top side
ELС-460-34
300 Ø 80
typ.
dimensions in µm (±20 µm)
typ.
thickness 90 (±20) µm
P
300
front side metalization Au-alloy, 0.
5 µm backside metalization Al-alloy, 1.
5 µm
N
Maximum Ratings
Tamb = 25°C, unless otherwise specified Parameter Forward current (DC) Peak forward current Operating temperature range Storage temperature range (tP ≤ 50 µs, tP /T = 1/2) Test conditions Symbol IF IFM Tamb Tstg Value 30 100 -40 to +85 -40 to +100 Unit mA mA °C °C
Optical and Electrical Characteristics
Tamb = 25°C, unless otherwise specified Test Parameter conditions Forward voltage Reverse voltage Luminous intensity1 Peak wavelength Dominant wavelength Spectral bandwidth at 50% Switching time
1
Symbol VF VR Ιv λP λD ∆λ0.
5 tr , t f
Min
Typ 3.
3
Max 3.
5
Unit V V
IF = 20 mA IF = 10 µA IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA IF = 20 mA
5 50 450 60 460 463 25 20 470
mcd nm nm nm ns
Measured on bare chip on TO-18 header with EPIGAP equipment Ιv(typ) [mcd]
Labeling
Type ELС-460-34 Lot N° VF(typ) [V] Quantity
Packing: Chips on adhesive film with wire-bond side on top
EPIGAP Optoelektronik GmbH, D-12555 Berlin, Köpenicker Str.
325 b, Haus 201 Tel.
: +49-30-6576 2543, Fax : +49-30-6576 2545 1 of 1
...
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