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BAS16DXV6T5

ON Semiconductor
Part Number BAS16DXV6T5
Manufacturer ON Semiconductor
Description (BAS16DXV6T1 / BAS16DXV6T5) Dual Switching Diode
Published Jan 12, 2007
Detailed Description www.DataSheet4U.com BAS16DXV6T1, BAS16DXV6T5 Preferred Device Dual Switching Diode Features • Pb−Free Packages are Av...
Datasheet PDF File BAS16DXV6T5 PDF File

BAS16DXV6T5
BAS16DXV6T5


Overview
www.
DataSheet4U.
com BAS16DXV6T1, BAS16DXV6T5 Preferred Device Dual Switching Diode Features • Pb−Free Packages are Available MAXIMUM RATINGS (TA = 25°C) Rating Continuous Reverse Voltage Recurrent Peak Forward Current Peak Forward Surge Current Pulse Width = 10 ms Symbol VR IF IFM(surge) Max 75 200 500 Unit V mA mA http://onsemi.
com 6 4 1 3 6 54 2 3 THERMAL CHARACTERISTICS Characteristic (One Junction Heated) Total Device Dissipation Derate above 25°C Thermal Resistance Junction-to-Ambient Characteristic (Both Junctions Heated) Total Device Dissipation Derate above 25°C Thermal Resistance Junction-to-Ambient Junction and Storage Temperature RqJA TJ, Tstg TA = 25°C RqJA TA = 25°C Symbol PD Max 357 (Note 1) 2.
9 (Note 1) 350 (Note 1) Max 500 (Note 1) 4.
0 (Note 1) 250 (Note 1) −55 to +150 Unit mW mW/°C °C/W 1 SOT−563 CASE 463A PLASTIC MARKING DIAGRAM A6 MG G A6 = Specific Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) Symbol PD Unit mW mW/°C °C/W °C ORDERING INFORMATION Device BAS16DXV6T1 BAS16DXV6T1G BAS16DXV6T5 BAS16DXV6T5G Package SOT−563 SOT−563 (Pb−Free) SOT−563 SOT−563 (Pb−Free) Shipping† 4 mm pitch 4000/Tape & Reel 4 mm pitch 4000/Tape & Reel 2 mm pitch 8000/Tape & Reel 2 mm pitch 8000/Tape & Reel Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously.
If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected.
1.
FR−4 @ Minimum Pad †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
Preferred devices are recommended choices for future use and best overall value.
© Semiconductor Components Industries, LLC, 2005 1 November, 2005 − Rev.
2 Publication Order Number: BAS16...


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