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SemiWell Semiconductor
SFD3055L
Logic N-Channel MOSFET
Features
■
Low RDS(on) (0. 15Ω )@VGS=10V Low RDS(on) (0. 30Ω )@VGS=4. 5V Low Gate Charge (Typical 6. 5nC) Improved dv/dt Capability 100% Avalanche Tested Maximum Junction Temperature Range (150°C)
Symbol
◀
{
{
2. Drain
●
■ ■ ■ ■
1. Gate
▲
● ●
{
3. Source
General Description
This Power MOSFET is produced using SemiWell’s advanced planar stripe, DMOS technology. This latest technology has been especially designed to minimize on-state resistance, have a low gate charge with superior switching performance and rugged avalanche characteristics. This Power MOSFET is well suited for synchronous DC-DC Converters and Power Management in portable and battery operated products.
D-PACK (TO-252)
2
1 3
Absolute Maximum Ratings
Symbol
VDSS ID IDM VGS EAS dv/dt PD TSTG, TJ TL Drain to Source Voltage Continuous Drain Current(@TC = 25°C) Continuous Drain Current(@TC = 100°C) Drain Current Pulsed Gate to Source Voltage Single Pulsed Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation(@TA = 25 °C) Total Power Dissipation(@TC = 25 °C) Derating Factor above 25 °C Operating Junction Temperature & Storage Temperature Maximum Lead Temperature for soldering purpose, 1/8 from Case for 5 seconds.
(Note 2) (Note 3) (Note 1)
Parameter
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Value
30 12 7. 7 30
Units
V A A A V mJ V/ns W W W/°C °C °C
DataShee
±20
30 7. 0 2. 5 42 0. 34 - 55 ~ 150 300
Thermal Characteristics
Symbol
RθJC RθJA
Parameter
Thermal Resistance, Junction-to-Case Thermal Resistance, Junction-to-Ambient
Value Min.
-
Typ.
-
Max.
3 50
Units
°C/W °C/W
December, 2002. Rev. 0.
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SFD3055L
Electrical Characteristics
Symbol Off Characteristics
BVDSS Δ BVDSS/ Δ TJ IDSS Drain-Source Breakdown Voltage VGS = 0V, ID = 250uA 30 0. 027 1 10 100 -100 V V/°C uA uA nA nA ( TC = 25 °C unless otherwise ...