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CM1409

ON Semiconductor

LCD and Camera EMI Filter - ON Semiconductor


CM1409
CM1409

PDF File CM1409 PDF File



Description
CM1409 LCD and Camera EMI Filter Array with ESD Protection Product Description The CM1409 is a family of pi−style EMI filter arrays with ESD protection, which integrates either six or eight filters (C−R−C) in a small form factor, WDFN 0.
50 mm pitch package.
The CM1409 has component values of 15 pF − 100 W − 15 pF per channel.
The CM1409 has a cut−off frequency of 110 MHz and can be used in applications with data rates up to 44 Mbps.
The parts include ESD diodes on every pin, which provide a very high level of protection for sensitive electronic components against electrostatic discharge (ESD).
The ESD protected diodes safely dissipate ESD strikes of ±15 kV, which even exceeds the maximum requirement of the IEC61000−4−2 international standard.
Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the pins are protected for contact discharges at greater than ±30 kV.
These devices are particularly well−suited for portable electronics (e.
g.
wireless handsets, PDAs, notebook computers) because of their small package and easy−to−use pin assignments.
In particular, the CM1409 is ideal for EMI filtering and protecting data and control lines for the I/O data ports, LCD display and camera interface in mobile handsets.
The CM1409 is housed in space−saving, low−profile 12− and 16−lead WDFN packages with a 0.
50 mm pitch, RoHS−compliant, lead−free finishing.
Features • Six or Eight Channels of EMI Filtering with Integrated ESD Protection • Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network • ±15 kV ESD Protection on Each Channel (IEC 61000−4−2 Level 4, Contact Discharge) • ±30 kV ESD Protection on Each Channel (HBM) • Greater than −35 dB Attenuation (Typical) at 1 GHz • WDFN Package with 0.
50 mm Lead Pitch: • 6−ch.
= 12−lead WDFN • 8−ch.
= 16−lead WDFN • Tiny WDFN Package Size: • 12−lead: 3.
0 mm x 1.
35 mm • 16−lead: 4.
0 mm x 1.
60 mm • Increased Robustness against Vertical Impacts During Manufacturing Process • These Devices are Pb...



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