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FAN3852

ON Semiconductor

Microphone Pre-Amplifier - ON Semiconductor


FAN3852
FAN3852

PDF File FAN3852 PDF File



Description
Microphone Pre-Amplifier with Digital Output FAN3852 Description The FAN3852 integrates a pre−amplifier, LDO, and ADC that converts Electret Condenser Microphone (ECM) outputs to digital Pulse Density Modulation (PDM) data streams.
The pre−amplifier accepts analog signals from the ECM and drives an over−sampled sigma delta Analog−to−Digital Converter (ADC) and outputs PDM data.
The PDM digital audio has the advantage of noise rejection and easy interface to mobile handset processors.
The FAN3852 features an integrated LDO and is powered from the system supply rails up to 3.
63 V, with low power consumption of only 0.
85 mW and less than 20 mW in Power−Down Mode.
Features • Optimized for Mobile Handset and Notebook PC Microphone Applications • Accepts Input from Electret Condenser Microphones (ECM) • Pulse Density Modulation (PDM) Output • Standard 5−Wire Digital Interface • Low Input Capacitance, High PSR, 20 kHz Pre−Amplifier • Low−Power 1.
5 mA Sleep Mode • Typical 420 mA Supply Current • SNR of 62 dB (A) for 16 dB Gain • Total Harmonic Distortion 0.
02% • Input Clock Frequency Range of 1−4 MHz • Integrated Low Drop−Out Regulator (LDO) • Small 1.
242 mm × 0.
842 mm 6−Ball, 0.
400 mm pitch standard WLCSP Package • 1.
5 kV HBM ESD on MIC Input Typical Applications • Electret Condenser Microphones with Digital Output • Mobile Handset • Headset Accessories • Personal Computer (PC) www.
onsemi.
com WLCSP−6 CASE 567TS CLOCK A1 A2 SELECT GND B1 B2 INPUT DATA C1 C2 VDD Top View PIN CONFIGURATION MARKING DIAGRAM Pin A1 VK&K &.
&2&Z VK = Device Identifier K = Lot Run Code .
= Pin A1 Mark 2 = Date Code Z = Plant Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet.
© Semiconductor Components Industries, LLC, 2016 1 June, 2021 − Rev.
4 Publication Order Number: FAN3852/D FAN3852 ORDERING INFORMATION Part Number FAN3852UC16X Operating Temperature Range −40°C to 85°C Package 6 Ball, Wafer−Level Chip−Scale Pac...



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