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FGH60N60

ON Semiconductor
Part Number FGH60N60
Manufacturer ON Semiconductor
Description IGBT
Published Oct 9, 2021
Detailed Description IGBT - Field Stop 600 V, 60 A FGH60N60SMD Description Using novel field stop IGBT technology, ON Semiconductor’s new ser...
Datasheet PDF File FGH60N60 PDF File

FGH60N60
FGH60N60

Overview
IGBT - Field Stop 600 V, 60 A FGH60N60SMD Description Using novel field stop IGBT technology, ON Semiconductor’s new series of field stop 2nd generation IGBTs offer the optimum performance for solar inverter, UPS, welder, telecom, ESS and PFC applications where low conduction and switching losses are essential.
Features • Maximum Junction Temperature: TJ = 175°C • Positive Temperature Co−efficient for easy Parallel Operating • High Current Capability • Low Saturation Voltage: VCE(sat) = 1.
9 V (Typ.
) @ IC = 60 A • High Input Impedance • Fast Switching: EOFF = 7.
5 uJ/A • Tightened Parameter Distribution • This Device is Pb−Free and is RoHS Compliant Applications • Solar Inverter, UPS, Welder, PFC, Telecom, ESS www.
onsemi.
com VCES 600 V IC 60 A C G E E C G COLLECTOR (FLANGE) TO−247−3LD CASE 340CK MARKING DIAGRAM $Y&Z&3&K FGH60N60 SMD © Semiconductor Components Industries, LLC, 2010 January, 2020 − Rev.
3 $Y &Z &3 &K FGH60N60SMD = ON Semiconductor Logo = Assembly Plant Code = Numeric Date Code = Lot Code = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet.
1 Publication Order Number: FGH60N60SMD/D FGH60N60SMD ABSOLUTE MAXIMUM RATINGS Symbol Description Ratings Unit VCES VGES Collector to Emitter Voltage Gate to Emitter Voltage Transient Gate to Emitter Voltage 600 V ±20 V ±30 V IC Collector Current TC = 25°C 120 A TC = 100°C 60 A ICM (Note 1) Pulsed Collector Current 180 A IF Diode Forward Current TC = 25°C 60 A TC = 100°C 30 A IFM (Note 1) Pulsed Diode Maximum Forward Current 180 A PD Maximum Power Dissipation TC = 25°C 600 W TC = 100°C 300 W TJ Operating Junction Temperature −55 to +175 °C TSTG Storage Temperature Range −55 to +175 °C TL Maximum Lead Temp.
for Soldering Purposes, 1/8” from Case for 5 Seconds 300 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device.
If any of these limits are exceeded,...


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