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25Q64FVSIG

Winbond
Part Number 25Q64FVSIG
Manufacturer Winbond
Published Dec 18, 2020
Description 3V 64M-BIT SERIAL FLASH MEMORY
Detailed Description W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision ...
Datasheet PDF File 25Q64FVSIG PDF File

25Q64FVSIG
25Q64FVSIG


Overview
W25Q64FV 3V 64M-BIT SERIAL FLASH MEMORY WITH DUAL/QUAD SPI & QPI Publication Release Date: July 18, 2017 -1 Revision S W25Q64FV Table of Contents 1.
GENERAL DESCRIPTION .
5 2.
FEATURES 5 3.
PACKAGE TYPES AND PIN CONFIGURATIONS 6 3.
1 Pin Configuration SOIC / VSOP 208-mil .
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6 3.
2 Pad Configuration WSON 6x5-mm / 8X6-mm, XSON 4x4-mm .
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6 3.
3 Pin Configuration PDIP 300-mil .
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7 3.
4 Pin Description SOIC/VSOP 208-mil, WSON 6x5/8x6-mm, XSON 4x4-mm and PDIP 300mil 7 3.
5 Pin Configuration SOIC 300-mil .
8 3.
6 Pin Description SOIC 300-mil 8 3.
7 Ball Configuration TFBGA 8x6-mm (5x5 or 6x4 Ball Array) .
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9 3.
8 Ball Description TFBGA 8x6-mm .
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9 3.
9 Ball Configuration WLCSP .
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10 3.
10 Ball Description WLCSP.
10 4.
PIN DESCRIPTIONS .
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11 4.
1 Chip Select (/CS) .
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