DatasheetsPDF.com

LMZ31506

Texas Instruments
Part Number LMZ31506
Manufacturer Texas Instruments
Description Power Module
Published Jun 2, 2020
Detailed Description Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design LMZ31506 SNVS99...
Datasheet PDF File LMZ31506 PDF File

LMZ31506
LMZ31506


Overview
Product Folder Order Now Technical Documents Tools & Software Support & Community Reference Design LMZ31506 SNVS993B – JUNE 2013 – REVISED APRIL 2018 LMZ31506 6-A Power Module With 2.
95-V to 14.
5-V Input and Current Sharing in QFN Package 1 Features •1 Complete Integrated Power Solution Allows Small Footprint, Low-Profile Design • 9-mm × 15-mm × 2.
8-mm package - Pin Compatible with LMZ31503 • Efficiencies Up To 96% • Wide-Output Voltage Adjust 0.
6 V to 5.
5 V, with 1% Reference Accuracy • Supports Parallel Operation for Higher Current • Optional Split Power Rail Allows Input Voltage down to 1.
6 V • Adjustable Switching Frequency (250 kHz to 780 kHz) • Synchronizes to an External Clock • Adjustable Slow-Start • Output Voltage Sequencing / Tracking • Power Good Output • Programmable Undervoltage Lockout (UVLO) • Output Overcurrent Protection (Hiccup Mode) • Over-Temperature Protection • Pre-bias Output Start-up • Operating Temperature Range: –40°C to 85°C • Enhanced Thermal Performance: 13°C/W • Meets EN55022 Class B Emissions - Integrated Shielded Inductor • Create a Custom Design Using the LMZ31506 With the WEBENCH® Power Designer 2 Applications • Broadband & Communications Infrastructure • Automated Test and Medical Equipment • Compact PCI, PCI Express and PXI Express • DSP and FPGA Point of Load Applications 3 Description The LMZ31506 power module is an easy-to-use integrated power solution that combines a 6-A DC-toDC converter with power MOSFETs, a shielded inductor, and passives into a low profile, QFN package.
This total power solution allows as few as three external components and eliminates the loop compensation and magnetics part selection process.
The 9×15×2.
8 mm QFN package is easy to solder onto a printed circuit board and allows a compact point-of-load design with greater than 90% efficiency and excellent power dissipation with a thermal impedance of 13°C/W junction to ambient.
The device delivers the full 6-A rated output current at 85°C ambient ...



Similar Datasheet


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site. (Privacy Policy & Contact)