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AN17820B

Matsushita
Part Number AN17820B
Manufacturer Matsushita
Description LOW-FREQUENCY AMPLIFIER
Published Sep 21, 2019
Detailed Description www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com www.DataSheet4U.com Prepared Lim Fu...
Datasheet PDF File AN17820B PDF File

AN17820B
AN17820B

Overview
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DataSheet4U.
com www.
DataSheet4U.
com www.
DataSheet4U.
com www.
DataSheet4U.
com www.
DataSheet4U.
com Prepared Lim Fuey Sheen Checked Kenneth Law Approved Yasuo Higuchi Product Specifications AN17820B Ref No.
Total Page Page No.
Package Name FP-12S Unit : mm E 18 6 ∅ 3.
6 6.
4 ± 0.
3 7.
7 ± 0.
3 7.
8 ± 0.
3 www.
DataSheet4U.
com 29.
6 ± 0.
3 1 12 0.
6 ± 0.
1 29.
96 ± 0.
3 28.
0 ± 0.
3 20.
0±0.
1 R1.
8 +0.
1 0.
25 -0.
05 2.
54 3.
5 ± 0.
3 0.
6 1.
2 ± 0.
1 Eff.
Date Eff.
Date 30 April 2003 - FMSC-PSDA-002-01 REV 1 *3 Eff.
Date Eff.
Date - 19-JAN-05 Semiconductor Company, Matsushita Electric Industrial Co.
, Ltd.
Prepared Lim Fuey Sheen Checked Kenneth Law Approved Yasuo Higuchi Product Specifications (Leadfree) AN17820B Ref No.
Total Page Page No.
F 18 7A (Structure Description) Chip surface passivation SiN, PSG, Others ( )1 Lead frame material Fe group, Cu group, Others ( ) 2, 6 Inner lead surface process Ag plating, Au plating, Others ( *2 Outer lead surface process Solder plating (98Sn-2Bi), Solder dip, Others ( )2 )6 *2 Chip mounting method Ag paste, Au-Si alloy, Solder (95.
5Pb-2.
5Ag-2Sn)** 3 Wire bonding method Thermalsonic bonding, Others ( )4 Wire material Au, Others ( )4 Mold material Epoxy, Others ( )5 Molding method Transfer mold, Multiplunger mold, Others ( )5 Fin material Cu group, Others ( )7 Package FP-12S **Under RoHS exemption clause, Lead (Pb) in high melting temperature type solder (i.
e.
tin-lead solder alloys containing more than 85% of lead), is exempted until 2010.
43 1 56 72 *2 Eff.
Date Eff.
Date Eff.
Date Eff.
Date - 8-NOV-04 16-DEC-04 FMSC-PSDA-002-01 REV 1 Semiconductor Company, Matsushita Electric Industrial Co.
, Ltd.
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