Glass Passivated Bridge Rectifiers - Taiwan Semiconductor
Description
GBPC15, 25, 35 SERIES
Taiwan Semiconductor
15A, 25A, 35A, 50V - 1000V Standard Bridge Rectifier
FEATURES
● Glass passivated chip junction ● Integrally molded heatsink provide very low thermal resistance
for maximum heat dissipation ● Typical IR less than 0.
2μA ● High surge current capability ● UL Recognized File # E-326243 ● RoHS Compliant
APPLICATIONS
● Switching mode power supply (SMPS) ● AC to DC converter
KEY PARAMETERS
PARAMETER VALUE UNIT
IF
15, 25, 35
A
VRRM
50 - 1000
V
IFSM
300, 400
A
TJ MAX
150
°C
Package
GBPC
Configuration
Quad
MECHANICAL DATA
● Case: GBPC GBPC-W: Wire structure GBPC40-M: Terminal cathode parallel to anode
● Molding compound meets UL 94V-0 flammability rating ● Terminal: Matte tin plated leads, solderable per J-STD-002 ● Meet JESD 201 class 1A whisker test ● Mounting torque: 20 in-lbs maximum ● Polarity: As marked ● Weight: 16.
95g (approximately)
GBPC
GBPC-W
GBPC-M
ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted)
PARAMETER
SYMBOL 005 01 02 04 06
Repetitive peak reverse voltage
VRRM
50 100 200 400 600
Reverse voltage, total rms value
VR(RMS)
35 70 140 280 420
GBPC15
15
Forward current
GBPC25
IF
25
GBPC35
35
Peak forward surge current, GBPC15
8.
3ms single half sine-wave GBPC25
IFSM
300
superimposed on rated load GBPC35
400
GBPC15
Rating for fusing (t<8.
3ms) GBPC25
I2t
373
GBPC35
664
Junction temperature
TJ
- 55 to +150
Storage temperature
TSTG
- 55 to +150
08 10 UNIT 800 1000 V 560 700 V
A A A
A
A A2s A2s °C °C
1
Version: L2103
GBPC15, 25, 35 SERIES
Taiwan Semiconductor
THERMAL PERFORMANCE
PARAMETER Junction-to-case thermal resistance
SYMBOL RӨJC
TYP 1.
5
UNIT °C/W
ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted)
PARAMETER
CONDITIONS
SYMBOL
GBPC15 IF = 7.
5A, TJ = 25°C
Forward voltage per diode(1) GBPC25 IF = 12.
5A, TJ = 25°C
VF
GBPC35 IF = 17.
5A, TJ = 25°C
Reverse current @ rated VR per diode(2) TJ = 25°C
IR
Notes:
1.
Pulse test with PW = 0.
3...
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