DatasheetsPDF.com

• Hyper Fast Recovery: 35nsec Maximum
• Low Forward Voltage Drop
• Low Reverse Leakage Current
• Single Chip Construction
• Hermetically Sealed Package
• Metalurgically Bonded Construction
• TX, TXV, and S-Level Screening Available 2/ Maximum Ratin...

Since 2006. D4U Semicon,
Electronic Components Datasheet Search Site. (Privacy Policy & Contact)