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S9012-H Datasheet

PNP Silicon Transistors

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S9012-H pdf
MCC
TM
Micro Commercial Components
  omponents
20736 Marilla Street Chatsworth

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$ %    !"#
Features
TO-92 Plastic-Encapsulate Transistors
Capable of 0.625Watts(Tamb=25OC) of Power Dissipation.
Collector-current 0.5A
Collector-base Voltage 40V
Operating and storage junction temperature range: -55OC to +150OC
Marking : S9012
Lead Free Finish/RoHS Compliant ("P" Suffix designates
RoHS Compliant. See ordering information)
Epoxy meets UL 94 V-0 flammability rating
Moisure Sensitivity Level 1
Halogen free available upon request by adding suffix "-HF"
S9012-G
S9012-H
S9012-I
PNP Silicon
Transistors
TO-92
A
E
Electrical Characteristics @ 25OC Unless Otherwise Specified
Symbol
Parameter
Min Max Units
OFF CHARACTERISTICS
V(BR)CBO
V(BR)CEO
V(BR)EBO
ICBO
Collector-Base Breakdown Voltage
(IC=100uAdc, IE=0)
Collector-Emitter Breakdown Voltage
(IC=0.1mAdc, IB=0)
Emitter-Base Breakdown Voltage
(IE=100uAdc, IC=0)
Collector Cutoff Current
(VCB=40Vdc, IE=0)
ICEO Collector Cutoff Current
(VCE=20Vdc, IB=0)
IEBO Emitter Cutoff Current
(VEB=5.0Vdc, IC=0)
ON CHARACTERISTICS
40 --- Vdc
25 --- Vdc
5.0 --- Vdc
--- 0.1 uAdc
--- 0.2 uAdc
--- 0.1 uAdc
hFE(1)
DC Current Gain
(IC=1mAdc, VCE=4.0Vdc)
hFE(2)
VCE(sat)
VBE(sat)
DC Current Gain
(IC=500mAdc, VCE=1.0Vdc)
Collector-Emitter Saturation Voltage
(IC=500mAdc, IB=50mAdc)
Base-Emitter Saturation Voltage
(IC=500mAdc, IB=50mAdc)
VEB Base- Emitter Voltage
(IE=100mAdc)
SMALL-SIGNAL CHARACTERISTICS
64 400 ---
40 --- ---
--- 0.6 Vdc
--- 1.2 Vdc
--- 1.4 Vdc
fT Transistor Frequency
150 --- MHz
(IC=20mAdc, VCE=6.0Vdc, f=30MHz)
CLASSIFICATION OF HFE (1)
Rank
Range
G
112 -166
H
144 -202
I
190 -300
B
C
D
EBC
EB C
STRAIGHT LEAD BENT LEAD
G BULK PACK AMMO PACK
DIMENSIONS
INCHES
MM
DIM MIN
MAX MIN MAX NOTE
A .175 .185 4.45 4.70
B .175 .185 4.45 4.70
C .500
--- 12.70
---
D .016 .020 0.41 0.63
E .135 .145 3.43 3.68
G
.095
.173
.105 2.42 2.67 Straight Lead
.220 4.40 5.60 Bent Lead
* For ammo packing detailed specification, click here to visit our website
of product packaging for details.
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